Neunkirchen, Germany

Benedict Bonpain

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Robert Bosch. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Benedict Bonpain. Retrieved from https://idiyas.com/inventor/benedict-bonpain

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

Loading Chart...
Loading Chart...
1 patent (USPTO):Explore Patents

Title: The Innovations of Benedict Bonpain

Introduction: Benedict Bonpain is an inventor based in Neunkirchen, Germany. He is currently employed at Mahle International GmbH, where he contributes to the development of innovative technologies. Although he has not yet been granted any patents, his work in the field of electrical components and thermal management is noteworthy.

Latest Patent Applications: One of his notable patent applications is for a "Plug-in Module and Module Assembly." This invention includes a module housing, a heat-dissipating device, and an electrical component arranged on a printed circuit board. The heat-dissipating device features an internal thermal interface that thermally couples the electrical component to the heat-dissipating device. Additionally, it has an external thermal interface designed to connect at least one heat-dissipating device to an external heat sink. This external thermal interface incorporates a thermally conductive elastic compensating element, which is compressed during the formation of the interface. Furthermore, the plug-in module includes a thermally conductive slidable contact element that forms a thermal contact surface with the external heat sink.

Conclusion: Benedict Bonpain's contributions to the field of electrical engineering, particularly through his innovative patent application, highlight his potential as an inventor. His work at Mahle International GmbH showcases his commitment to advancing technology in thermal management systems.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…