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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12795869 B1

PDFFull Text
Date of Patent:
Nov. 10, 2026

Filed:

Mar. 29, 2022

Plug-in module with heat-dissipating interfaces for a module assembly

Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Benedict Bonpain, Neunkirchen, DE;

Florian Burger, Wendlingen, DE;

Manuel Maul, Keltern, DE;

Matthias Engel, Stuttgart, DE;

Roland Hellwig, Vaihingen, DE;

Assignee:

ROBERT BOSCH GMBH, Stuttgart, DE;

Attorney:

NORTON ROSE FULBRIGHT US LLP

Primary Examiner:

Jayprakash N Gandhi

Assistant Examiner:

Steven undefined Ngo

Int. Cl.
CPC ...
H05K 7/20 (2006.01); H10W 40/22 (2026.01); H10W 40/60 (2026.01);
U.S. Cl.
CPC ...
H05K 7/20854 (2013.01); H05K 7/20409 (2013.01); H05K 7/20454 (2013.01); H05K 7/205 (2013.01); H10W 40/22 (2026.01); H10W 40/611 (2026.01); H05K 7/209 (2013.01);
Abstract

A plug-in module. The plug-in module includes a module housing, a heat-dissipating device, and an electrical component arranged on a printed circuit board. The heat-dissipating device has, on a surface facing the electrical component, an internal thermal interface to thermally couple the electrical component to the heat-dissipating device. The heat-dissipating device has, on a surface facing away from the electrical component, an external thermal interface to thermally couple at least one heat-dissipating device to an external heat sink. The external thermal interface includes a thermally conductive elastic compensating element connected to the heat-dissipating device and designed to be compressed during formation of the external thermal interface. The plug-in module also includes a thermally conductive slidable contact element applied to the thermally conductive elastic compensating element to form a thermal contact surface of the external thermal interface to the external heat sink and compress the thermally conductive elastic compensating element.

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Bonpain, Benedict. (2026). Plug-in module with heat-dissipating interfaces for a module assembly (U.S. Patent No. 12795869). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12795869

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