Ben Wu

Title: Innovations by Ben Wu: A Look at His Contributions to Electronic Circuitry

Introduction

Ben Wu is an accomplished inventor based in Shenzhen, China. He has made significant contributions to the field of electronic circuitry, holding a total of 5 patents. His work focuses on improving the functionality and efficiency of electronic devices.

Latest Patents

One of Ben Wu's latest patents is an innovative electronic circuitry socket structure. This invention includes a housing and pins connected to the housing, designed to enhance the performance of electronic devices. The housing features a base with an inner and outer face, a riser extending away from the outer face, and a wall connected to the riser. The design incorporates mounting ports and exit ports to facilitate the connection of pins, ensuring a reliable and efficient socket structure.

Another notable patent addresses the issue of solder paste misprint cleaning. This invention involves a processor that receives solder paste information and determines the minimum magnetic force required to remove solder paste from a printed circuit board. By adjusting the power applied to an electromagnet, the processor effectively cleans misprints, improving the assembly process of printed circuit boards.

Career Highlights

Ben Wu is currently employed at International Business Machines Corporation (IBM), where he continues to innovate and develop new technologies. His work at IBM has allowed him to collaborate with other talented professionals in the field.

Collaborations

Some of Ben Wu's coworkers include YanLong Hou and WeiFeng Zhang. Their collaborative efforts contribute to the advancement of technology and innovation within the company.

Conclusion

Ben Wu's contributions to electronic circuitry and his innovative patents demonstrate his commitment to advancing technology. His work not only enhances the functionality of electronic devices but also streamlines manufacturing processes.