IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10576566 B1

PDFFull Text
Date of Patent:
Mar. 03, 2020

Filed:

Jun. 06, 2016

Solder paste misprint cleaning

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Xingquan Dong, Shenzhen, CN;

Yanlong Hou, Shenzhen, CN;

LiCen Mu, Shenzhen, CN;

Ben Wu, Shenzhen, CN;

WeiFeng Zhang, Shenzhen, CN;

Assignee:

International Business Machines Corporation, Armonk, NY (US);

Attorney:

Isaac J. Gooshaw

Primary Examiner:

Devang R Patel

Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 3/00 (2006.01); B23K 35/00 (2006.01); H05K 3/00 (2006.01); B23K 1/018 (2006.01); B23K 3/04 (2006.01); B23K 3/08 (2006.01); B23K 35/26 (2006.01); B23K 35/30 (2006.01); B23K 35/36 (2006.01); B23K 35/02 (2006.01); H05K 3/22 (2006.01); H05K 3/34 (2006.01); B23K 31/02 (2006.01); B23K 31/12 (2006.01);
U.S. Cl.
CPC ...
B23K 1/018 (2013.01); B23K 1/0016 (2013.01); B23K 3/04 (2013.01); B23K 3/08 (2013.01); B23K 31/02 (2013.01); B23K 31/12 (2013.01); B23K 35/02 (2013.01); B23K 35/025 (2013.01); B23K 35/0222 (2013.01); B23K 35/0244 (2013.01); B23K 35/262 (2013.01); B23K 35/302 (2013.01); B23K 35/3006 (2013.01); B23K 35/3033 (2013.01); B23K 35/3053 (2013.01); B23K 35/36 (2013.01); H05K 3/225 (2013.01); H05K 3/3484 (2013.01); G05B 2219/37215 (2013.01); G05B 2219/45235 (2013.01); H05K 3/34 (2013.01); H05K 2201/083 (2013.01); H05K 2203/0445 (2013.01); H05K 2203/104 (2013.01); H05K 2203/163 (2013.01);
Abstract

A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.

Find Patent Forward Citations

Loading…