Bei Fu

Title: Bei Fu and a Low-Interference USB Connector Design

Introduction

Bei Fu is an inventor associated with Dongguan, China, and Huawei Technologies Co., Limited. Her listed patent focuses on reducing electromagnetic interference and short-circuit risk in USB connections. The supplied information lists 1 patent for Fu.

Latest Patents

Fu’s listed invention, “USB Connector with Double Shield Layers,” describes a USB connection designed for situations where the distance between a connector pin and the terminal device’s metal housing is small. The design connects two plugs with a cable containing overlapping first and second shield layers that are not electrically connected to each other.

One end of the first shield layer connects to the metal housing of the first plug, while its other end remains suspended. The second shield layer is arranged similarly, connecting at one end to the second plug’s metal housing and remaining suspended at the other. The patent also describes using capacitive components to connect the metal housings of USB sockets to the housing of a terminal device or adapter. These measures are intended to help reduce radiation and the risk of short circuits.

Career Highlights

The available information associates Fu with Huawei Technologies Co., Limited and identifies her work on a USB connector design addressing electromagnetic interference and electrical safety concerns. No further career details were provided.

Collaborations

The supplied information names Ke Ai and Tongjie Li as Fu’s coworkers. It does not specify their roles in the patent or describe any particular collaboration.

Conclusion

Bei Fu’s listed patent presents a double-shield-layer approach to managing interference and short-circuit risks in USB connections, reflecting a practical focus on connector design.