The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2021

Filed:

Nov. 27, 2017
Applicant:

Huawei Technologies Co., Ltd., Guangdong, CN;

Inventors:

Tongjie Li, Shenzhen, CN;

Ke Ai, Shenzhen, CN;

Bei Fu, Dongguan, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/6592 (2011.01); H01R 13/6598 (2011.01); H01R 13/66 (2006.01); H01R 31/06 (2006.01); H02J 7/00 (2006.01);
U.S. Cl.
CPC ...
H01R 13/6592 (2013.01); H01R 13/6598 (2013.01); H01R 13/6625 (2013.01); H01R 31/06 (2013.01); H02J 7/0042 (2013.01);
Abstract

The present invention provides a method for designing USB floating with low electromagnetic interference, especially in a scenario in which a distance between a pin and a metal housing of a USB interface of a terminal device is increasingly small. A first plug and a second plug are connected by using a connection cable having a first shield layer and a second shield layer. The first shield layer and the second shield layer overlap and there is no electrical connection between the first shield layer and the second shield layer. One end of the first shield layer is connected to a metal housing of the first plug, and the other end is suspended. One end of the second shield layer is connected to a metal housing of the second plug, and the other end is suspended. In addition, a metal housing of a first socket and a metal housing of a second socket may be connected to a housing of the terminal device or a housing of an adapter by using a capacitive component, thereby helping the terminal device reduce a short circuit risk and radiation.


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