This inventor holds 1 USPTO granted patent. Top assignee: Infineon Technologies Ag. Active years: 2010.
Company Filing History:
Years Active: 2010
Title: Innovations by Bee Ngoh Kee in Integrated Circuit Packaging
Introduction
Bee Ngoh Kee is an accomplished inventor based in Singapore, SG. He has made significant contributions to the field of integrated circuit packaging. His innovative approach has led to the development of a unique lead frame design that enhances the efficiency and reliability of integrated circuits.
Latest Patents
Bee Ngoh Kee holds a patent for the "Packaging of Integrated Circuits to Lead Frames." This patent describes a lead frame that comprises a main member and an engagement portion for receiving an integrated circuit. The integrated circuit is located at the engagement portion and is engaged with the lead frame through resilient engagement with the first and second engagement members. These members secure the integrated circuit to the lead frame by engaging in resilient contact with the opposed surfaces of the integrated circuit. This design eliminates the need for a gluing process, which is commonly used in conventional lead frame designs.
Career Highlights
Bee Ngoh Kee is currently employed at Infineon Technologies AG, where he continues to innovate in the field of semiconductor technology. His work has been instrumental in advancing the packaging techniques used for integrated circuits, making them more efficient and reliable.
Collaborations
Bee Ngoh Kee collaborates with Tian Siang Yip, who is also a talented professional in the field. Their combined expertise contributes to the innovative projects at Infineon Technologies AG.
Conclusion
Bee Ngoh Kee's contributions to integrated circuit packaging demonstrate his commitment to innovation and excellence in technology. His patent reflects a significant advancement in the field, showcasing his ability to solve complex engineering challenges.