The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2010
Filed:
Aug. 26, 2004
Tian Siang Yip, Singapore, SG;
Bee Ngoh Kee, Singapore, SG;
Tian Siang Yip, Singapore, SG;
Bee Ngoh Kee, Singapore, SG;
Infineon Technologies AG, Munich, DE;
Abstract
A lead frame () for housing an integrated circuit is disclosed comprising a main member () and an engagement portion () for receiving an integrated circuit (). The integrated circuit () is located at the engagement portion () and engaged with the lead frame through resilient engagement with the first and second engagement members (). The first and second engagement members () which depend from the main member, secure the integrated to the lead frame by engaging in resilient contact respective opposed surfaces of the integrated circuit. The integrated circuit is engaged to the lead frame by clipping into it into position between the engagement members. There is no need for a gluing process unlike conventional lead frame designs which where the integrated circuit is attached to a lead frame by gluing it onto the die paddle.