Shenzhen, China

Baowei Huang

USPTO Granted Patents = 4 

Average Co-Inventor Count = 1.1

ph-index = 2

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2022-2025

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4 patents (USPTO):

Title: Baowei Huang: Innovator in Semiconductor Technology

Introduction

Baowei Huang is a prominent inventor based in Shenzhen, China. He has made significant contributions to the field of semiconductor technology, holding a total of four patents. His work focuses on the development of advanced semiconductor structures, particularly in the area of insulated gate bipolar transistors (IGBT).

Latest Patents

Huang's latest patents include innovative designs such as a semiconductor cell structure and an IGBT cell structure. The IGBT cell structure features a unique arrangement that includes an N-type drift layer, an N-type termination layer, a P-type collector layer, and a collector metal layer stacked in sequence. Additionally, the structure incorporates two first trenches, a trench-shaped insulating oxide layer, a polysilicon electrode, and a trench-shaped gate oxide layer, among other components. These advancements are crucial for enhancing the performance and efficiency of semiconductor devices.

Career Highlights

Throughout his career, Baowei Huang has worked with notable companies in the semiconductor industry. He has been associated with Shenzhen Paqi Technology Co., Ltd. and BYD Semiconductor Company Limited. His expertise and innovative approach have positioned him as a key player in the development of cutting-edge semiconductor technologies.

Collaborations

Huang has collaborated with various professionals in the field, including his coworker Haiping Wu. These partnerships have facilitated the exchange of ideas and fostered innovation in semiconductor research and development.

Conclusion

Baowei Huang's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His work continues to pave the way for advancements in semiconductor applications.

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