Baohua Zhang

Title: Baohua Zhang - Innovator in Semiconductor Technology

Introduction

Baohua Zhang is a prominent inventor based in Hubei, China. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of advanced packaging techniques that enhance the performance of integrated circuits.

Latest Patents

Baohua Zhang holds a patent for "Flip-chip stacking structures and methods for forming the same." This patent describes a semiconductor package that includes a redistribution layer (RDL) with a first surface in contact with input/output (I/O) contacts and a second surface opposite to the first surface. The package features a staircase interconnect structure formed on the second surface of the RDL, which is electrically connected to the RDL. This structure includes staircase layers, allowing for efficient electrical connections between integrated circuit (IC) chips and the RDL.

Career Highlights

Baohua Zhang is currently employed at Yangtze Memory Technologies Co., Ltd. His work at this company focuses on advancing semiconductor technologies and improving the efficiency of memory devices. He has been recognized for his innovative approaches and technical expertise in the field.

Collaborations

Baohua Zhang collaborates with talented coworkers, including Xinru Zeng and Peng Chen. Together, they work on various projects aimed at enhancing semiconductor packaging and performance.

Conclusion

Baohua Zhang is a key figure in semiconductor innovation, with a focus on developing advanced packaging solutions. His contributions continue to shape the future of technology in this field.