This inventor holds 6 USPTO granted patents and 1 published patent application. Top assignees: Samsung Electronics Co., Ltd., University-Industry Cooperation Group of Kyung Hee University. Active years: 2022-2025.
Company Filing History:
6 out of 132,107 
2 out of 635 Years Active: 2022-2025
Title: Bangweon Lee: Innovator in Semiconductor Packaging
Introduction
Bangweon Lee is a prominent inventor based in Yongin, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 6 patents. His innovative designs have advanced the technology used in semiconductor devices, making them more efficient and reliable.
Latest Patents
Among his latest patents, one notable invention is a semiconductor package that includes a package substrate, a first semiconductor chip mounted on the substrate, and a first molding layer surrounding the chip. This design features a redistribution layer and through vias that connect various components, ensuring optimal electrical performance. Another patent describes a semiconductor package that incorporates a substrate with a thermal conductive plate, enhancing heat dissipation and overall functionality.
Career Highlights
Bangweon Lee has worked with leading organizations, including Samsung Electronics and the University-Industry Cooperation Group of Kyung Hee University. His experience in these esteemed institutions has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.
Collaborations
Throughout his career, Lee has collaborated with notable colleagues such as Seungtae Hwang and Se-Ho You. These partnerships have fostered a creative environment that has led to innovative solutions in the semiconductor industry.
Conclusion
Bangweon Lee's contributions to semiconductor packaging demonstrate his expertise and commitment to innovation. His patents reflect a deep understanding of technology and a drive to improve electronic devices.