This inventor holds 1 USPTO granted patent. Top assignee: Siemens Medical Solutions USA, Inc.. Active years: 2019.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2019
Title: BaikWoo Lee and Multidimensional Transducer Array Connections
Introduction
BaikWoo Lee is an inventor associated with Sammamish, Washington, and Siemens Medical Solutions USA, Inc. His patent work addresses electrical connections for multidimensional transducer arrays.
Latest Patents
Lee is credited with 1 patent: “Contact Pads for Electrical Module Assembly with Multidimensional Transducer Arrays.” The invention describes stacking circuit boards containing electronics to create a surface for connecting to a transducer array. The surface is metalized and diced to form larger contact pads, providing connection points for z-axis or other connectors serving the array’s elements.
Career Highlights
Lee’s listed patent reflects work on the practical challenge of interconnecting elements in multidimensional transducer arrays. By forming larger contact pads from a metalized, diced surface, the approach offers an alternative to relying on small exposed traces.
Collaborations
Lee’s listed coworkers include Stephen Roy Barnes and David A. Petersen. His patent is associated with Siemens Medical Solutions USA, Inc.
Conclusion
BaikWoo Lee’s patent focuses on a contact-pad design intended to support reliable electrical interconnection in multidimensional transducer array assemblies.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile