The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2019
Filed:
May. 11, 2017
Applicant:
Siemens Medical Solutions Usa, Inc., Malvern, PA (US);
Inventors:
BaikWoo Lee, Sammamish, WA (US);
Stephen R. Barnes, Bellevue, WA (US);
David A. Petersen, Fall City, WA (US);
Assignee:
Siemens Medical Solutions USA, Inc., Malvern, PA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B06B 1/06 (2006.01); G01S 15/89 (2006.01); G01S 7/52 (2006.01);
U.S. Cl.
CPC ...
H01L 23/00 (2013.01); B06B 1/0607 (2013.01); G01S 7/5208 (2013.01); G01S 15/8925 (2013.01);
Abstract
For multidimensional transducer array interconnection, circuit boards with electronics are stacked to form a surface for connection with the array. The surface of the circuit boards for connecting with the transducer array is metalized and diced. Rather than relying on small exposed traces, larger contact pads are formed by metalizing the surface and then dicing the surface. This forms an array of contact pads for connecting with the z-axis or other connectors for elements of the multidimensional transducer array.