This inventor holds 1 USPTO granted patent. Top assignee: Infineon Technologies Austria Ag. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Badrus Hisham Abdul Rani: Semiconductor Packaging Innovation
Introduction
Badrus Hisham Abdul Rani is an inventor associated with Muar, Malaysia, and Infineon Technologies Austria AG. His patent work addresses semiconductor packaging and product marking.
Latest Patents
Rani is credited with 1 patent: “Semiconductor Package and Method for Marking a Semiconductor Package.” The invention describes a package with opposing surfaces, plastic molding, and one or more semiconductor dies. Its first surface includes an exposed metallic area bearing one alphanumeric product marking, while the plastic molding bears a second alphanumeric product marking. This arrangement provides two locations for marking the semiconductor package.
Career Highlights
Rani’s listed patent reflects work on semiconductor package design and marking methods. His association with Infineon Technologies Austria AG connects his invention to the semiconductor industry.
Collaborations
Rani’s listed coworker is Wee Aun Jason Lim. The available information identifies their professional association but does not specify particular joint projects or co-inventorship.
Conclusion
Badrus Hisham Abdul Rani’s patent focuses on a practical semiconductor packaging feature: placing product markings on both an exposed metallic area and the molded surface.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile