The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Apr. 20, 2023
Infineon Technologies Austria Ag, Villach, AT;
Hwee Yin Low, Bukit Beruang, MY;
Badrus Hisham Abdul Rani, Muar Johor, MY;
Wee Aun Jason Lim, Melaka, MY;
AI Yun Loh, Melaka Tengah, MY;
Muhamad Hairul Fauzi Wahid, Melaka Tengah, MY;
Infineon Technologies Austria AG, Villach, AT;
Abstract
In an embodiment, a semiconductor package is provided that includes a first package surface and a second package surface opposing the first surface, a plastic molding and one or more semiconductor dies. The first package surface includes a first surface of the plastic molding and a first metallic area exposed from the plastic molding. The first metallic area includes a first product marking including at least one alphanumeric character and the first surface of the plastic molding includes a second product marking including at least one alphanumeric character.