This inventor holds 1 USPTO granted patent. Top assignee: Infineon Technologies Austria Ag. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Ai Yun Loh: Semiconductor Packaging Inventor
Introduction
Ai Yun Loh is an inventor associated with Malacca, Malaysia. Her patent work concerns semiconductor packaging and product marking. The available information lists 1 patent and identifies Infineon Technologies Austria AG as her company.
Latest Patents
Loh’s listed patent is “Semiconductor Package and Method for Marking a Semiconductor Package.” It describes a package with opposing first and second surfaces, plastic molding, and one or more semiconductor dies. The first surface includes an exposed metallic area and a surface of the plastic molding. Each area carries a product marking with at least one alphanumeric character.
Career Highlights
The patent reflects work on semiconductor package design and marking methods. Loh is associated with Infineon Technologies Austria AG.
Collaborations
Badrus Hisham Abdul Rani is identified as Loh’s coworker. The available information does not specify a particular joint patent or project between them.
Conclusion
Ai Yun Loh’s listed invention addresses how product markings can be incorporated into semiconductor packages, with her patent record connecting her work to Infineon Technologies Austria AG.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile