Aznita Abdul Aziz

Title: Aznita Abdul Aziz: Semiconductor Packaging Inventor.

Introduction

Aznita Abdul Aziz is an inventor associated with Puchong, Malaysia, and NXP USA, Inc. His patent work addresses electronic device packaging, with a focus on controlling adhesive flow around package components.

Latest Patents

The provided information lists one patent for Abdul Aziz: Package with solder mask. The invention describes a solder mask positioned to help prevent resin or other adhesive from spreading from the die and die-bond-pad region onto other package surfaces, including wire-bond pads. The mask can cover part of the conductive layer between the die-bond pad and wire-bond pads, and may be formed on the package substrate before the die is attached. The supplied data does not establish when this patent was granted or whether it is his latest patent. His listed patent count is 1 patent.

Career Highlights

Abdul Aziz is associated with NXP USA, Inc., a company working in the semiconductor industry. His listed invention concerns a practical packaging challenge: limiting adhesive leakage that could affect nearby surfaces and connections.

Collaborations

The supplied information identifies Nor Azhan Bin Mahmood as Abdul Aziz’s coworker. It does not specify their roles or describe a particular joint project.

Conclusion

Aznita Abdul Aziz’s listed patent reflects an engineering contribution to electronic device packaging, using a solder-mask arrangement to help protect package surfaces from adhesive leakage.