Company Filing History:
Years Active: 2008
Title: Azizi Abdul Rakman: Innovator in Ball-Grid-Array Solder Joint Reliability
Introduction
Azizi Abdul Rakman is a notable inventor based in Kulim, Malaysia. He has made significant contributions to the field of printed circuit boards, particularly in enhancing the reliability of ball-grid-array solder joints. His innovative approach addresses critical challenges faced in electronic manufacturing.
Latest Patents
Azizi holds a patent for "Apparatuses and methods for improving ball-grid-array solder joint reliability." This invention focuses on creating apparatuses that include a stiffened printed circuit board with cavities and stiffening members. These features are strategically designed to resist deflection caused by forces applied during testing, thereby improving the overall reliability of solder joints in printed circuit boards.
Career Highlights
Azizi Abdul Rakman is currently employed at Intel Corporation, where he continues to develop and refine technologies that enhance electronic components. His work is pivotal in ensuring that electronic devices function reliably under various conditions.
Collaborations
Throughout his career, Azizi has collaborated with talented individuals such as Sheng Cheang Ch'ng and Teik Sean Toh. These partnerships have fostered innovation and contributed to the advancement of technology in their field.
Conclusion
Azizi Abdul Rakman is a distinguished inventor whose work in improving ball-grid-array solder joint reliability has made a significant impact in the electronics industry. His contributions continue to shape the future of printed circuit board technology.