The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2008
Filed:
Jul. 30, 2004
Sheng Cheang Ch'ng, Balik Pulau, MY;
Azizi Abdul Rakman, Kulim, MY;
Teik Sean Toh, Sungai Petani, MY;
Sheng Cheang Ch'ng, Balik Pulau, MY;
Azizi Abdul Rakman, Kulim, MY;
Teik Sean Toh, Sungai Petani, MY;
Intel Corp., Santa Clara, CA (US);
Abstract
In some embodiments, apparatuses and methods for improving ball-grid-array solder joint reliability in printed circuit boards. Such apparatuses may comprise, in an exemplary embodiment, a stiffened printed circuit board defining one or more cavities therein and including one or more stiffening members positioned, respectively, in the one or more cavities. The cavities and embedded stiffening members may be located proximate a ball-grid-array device footprint so as to resist deflection caused by the application of forces to the board by test probe pins during testing. Such methods may include, in an exemplary embodiment, creating one or more cavities in a middle sub-layer of a core layer of a stiffened printed circuit board and inserting one or more stiffening members, respectively, therein. Top and bottom sub-layers may then be secured to top and bottom surfaces of the middle sub-layer to complete the core layer. Other embodiments are also described and claimed.