Ayumi Yoshiba

Title: Ayumi Yoshiba: Inventor of a Solder-Bump Formation Method

Introduction

Ayumi Yoshiba is an inventor associated with Tokyo, Japan. Her patent work addresses solder-paste processing and the formation of solder bumps on members with multiple electrodes. The supplied information identifies her as a woman and lists one patent.

Latest Patents

Yoshiba’s listed patent is “Solder paste, method for forming solder bumps, and method for manufacturing member provided with solder bumps.” It describes applying solder paste containing solder particles and a volatile dispersion medium to a member with multiple surface electrodes. The member is first heated below the solder’s melting point to form a layer containing solder particles. It is then heated in a reducing atmosphere at or above the melting point to form solder bumps, after which residue between adjacent bumps is removed by cleaning. The method specifies solder particles with an average size of 10 μm or less and a dispersion-medium content of at least 30% by mass. Yoshiba is credited with 1 patent in the information provided.

Career Highlights

The listed patent highlights Yoshiba’s work on a process for producing solder bumps while managing particle size, paste composition, heating conditions, and residue removal. These details describe the invention’s technical approach; the supplied information does not provide further details about her career or patent-assignee organization.

Collaborations

Masumi Sakamoto and Shinichirou Sukata are identified as Yoshiba’s coworkers. The supplied information does not specify their roles in the patent or the nature of their collaboration.

Conclusion

Ayumi Yoshiba’s listed invention presents a solder-paste method for forming and cleaning solder bumps, with defined requirements for particle size and dispersion-medium content.