The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Feb. 03, 2021
Resonac Corporation, Tokyo, JP;
Yoshinori Ejiri, Tokyo, JP;
Shinichirou Sukata, Tokyo, JP;
Kunihiko Akai, Tokyo, JP;
Masumi Sakamoto, Tokyo, JP;
Chiaki Shimizu, Tokyo, JP;
Junichi Kakehata, Tokyo, JP;
Ayumi Yoshiba, Tokyo, JP;
Abstract
A method for forming solder bumps by using a solder paste containing solder particles and a volatile dispersion medium, the method including: applying a solder paste on a member having a plurality of electrodes on the surface; heating the member and the solder paste at a temperature below the melting point of solder constituting the solder particles to form a solder particle-containing layer; heating the member and the solder particle-containing layer in a reducing atmosphere and at a temperature equal to or higher than the melting point of the solder constituting the solder particles to form solder bumps; and removing, by cleaning, a residue of the solder particle-containing layer remaining between adjacent solder bumps, in which the solder particles have an average particle size of 10 μm or less, and the content of the dispersion medium in the solder paste is 30% by mass or more.