Saitama, Japan

Ayaka Seto

USPTO Granted Patents = 1 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Ayaka Seto: Innovator in Adhesive Technology

Introduction

Ayaka Seto is a prominent inventor based in Saitama, Japan. She has made significant contributions to the field of adhesive technology, showcasing her innovative spirit and technical expertise. With a focus on developing advanced adhesive solutions, Seto has secured her place in the world of patents.

Latest Patents

Seto holds a patent for an adhesive sheet that features a pressure-sensitive adhesive layer. This innovative sheet includes a base material and a hot-melt pressure-sensitive adhesive layer containing a softener. Additionally, it incorporates a barrier layer positioned between the base material and the adhesive layer. This barrier layer consists of at least one resin selected from polyester-based, polyurethane-based, and polyolefin-based resins. The polyester-based resin may include either a polyester resin or a modified polyester resin. This patent highlights her commitment to enhancing adhesive performance and functionality.

Career Highlights

Ayaka Seto is currently employed at Lintec Corporation, where she continues to develop cutting-edge adhesive technologies. Her work at Lintec has allowed her to collaborate with other talented professionals in the field, further advancing her career and contributions to adhesive innovation.

Collaborations

Seto has worked alongside notable colleagues, including Toshiaki Nagasawa and Kenta Yamazaki. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of new technologies.

Conclusion

Ayaka Seto is a trailblazer in adhesive technology, with a patent that reflects her innovative approach to problem-solving. Her work at Lintec Corporation and collaborations with esteemed colleagues underscore her dedication to advancing the field. Seto's contributions are paving the way for future innovations in adhesive solutions.

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