This inventor holds 1 USPTO granted patent. Top assignee: Infineon Technologies Ag. Active years: 2003.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2003
Title: Axel Bürke: Innovator in Interconnect Fabrication
Introduction
Axel Bürke is a notable inventor based in Dresden, Germany. He has made significant contributions to the field of semiconductor technology, particularly in the fabrication of interconnects for contact holes. His innovative approach has led to the development of a reliable and cost-effective process that enhances the efficiency of semiconductor manufacturing.
Latest Patents
Axel Bürke holds a patent for a process titled "Process for fabricating an interconnect for contact holes." This patent outlines a method that includes forming contact holes in an insulation layer, cleaning the hole surface, and applying a barrier layer. The process further involves creating an AlGeCu-containing second interconnect layer through a low-temperature PVD process, which fills the contact holes. The method allows for direct patterning of the layer in a subsequent step, resulting in an interconnect that is both reliable and easy to integrate into existing manufacturing processes. He has 1 patent to his name.
Career Highlights
Axel Bürke is associated with Infineon Technologies AG, a leading company in semiconductor solutions. His work has been instrumental in advancing the technology used in interconnect fabrication, contributing to the overall efficiency and reliability of semiconductor devices.
Collaborations
Throughout his career, Axel has collaborated with talented professionals such as Jens Hahn and Sven Schmidbauer. These collaborations have fostered innovation and have played a crucial role in the development of new technologies in the semiconductor industry.
Conclusion
Axel Bürke's contributions to the field of semiconductor technology through his innovative patent demonstrate his commitment to advancing manufacturing processes. His work continues to influence the industry, paving the way for future innovations in interconnect fabrication.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
