The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2003
Filed:
Jun. 28, 2001
Infineon Technologies AG, Munich, DE;
Abstract
A process for fabricating an interconnect for contact holes includes forming contact holes in an insulation layer leading to a first interconnect layer, cleaning the hole surface, forming a barrier layer on the hole surface, forming an AlGeCu-containing second interconnect layer on the insulation surface by a low-temperature PVD process to fill up the contact holes, forming and patterning a mask layer, and patterning the second interconnect layer by an anisotropic etching process using the mask layer. Due to the relatively small grain sizes and precipitations that are formed in the process, the layer can be patterned directly in a subsequent patterning step, resulting in an extremely reliable and inexpensive interconnect that is easy to integrate in existing process sequences.