Avrid J Berg

Title: Avrid J Berg: Innovator in Film Adhesive Bonding Technology

Introduction

Avrid J Berg is a notable inventor based in Seattle, WA, recognized for his contributions to adhesive bonding technology. He has developed a unique method for bonding two members together using solid film adhesive, which has significant implications in various industries.

Latest Patents

Berg holds a patent for a "Film adhesive bonding apparatus and process." This invention involves a method of bonding two members by utilizing a stack of solid film adhesive and a layer of solid film adhesive placed between the members. A pressure-applying device is employed to apply low pressure, which helps to compress the stack and remove air bubbles, ensuring a strong bond. Additionally, a heating device is used to transform the adhesive into a liquid state, creating a void-free bond-line between the members.

Career Highlights

Avrid J Berg is associated with The Boeing Company, where he applies his expertise in adhesive technologies. His work has contributed to advancements in manufacturing processes, particularly in the aerospace sector, where strong and reliable bonding is crucial.

Collaborations

Berg has collaborated with notable colleagues, including Donald A Anderson and Paul S Gregg, who have also made significant contributions to the field of adhesive bonding and related technologies.

Conclusion

Avrid J Berg's innovative work in film adhesive bonding technology showcases his commitment to advancing manufacturing processes. His patent reflects a significant step forward in creating strong, reliable bonds in various applications.