The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2012

Filed:

Nov. 09, 2006
Applicants:

Avrid J. Berg, Seattle, WA (US);

Donald A. Anderson, Bellevue, WA (US);

Paul S. Gregg, Seattle, WA (US);

Michael L. Leggett, Federal Way, WA (US);

Inventors:

Avrid J. Berg, Seattle, WA (US);

Donald A. Anderson, Bellevue, WA (US);

Paul S. Gregg, Seattle, WA (US);

Michael L. Leggett, Federal Way, WA (US);

Assignee:

The Boeing Company, Chicago, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention relates to a method of bonding two members together utilizing a stack of solid film adhesive and a layer of solid film adhesive, both disposed between the members. A pressure-applying device may be utilized to apply low pressure to force the members together. The pressure may force the stack to compress and expand in varying directions in order to substantially remove air-bubbles between the layer and one of the members. A heating device may be utilized to change the layer and the stack into liquid states in order to bond the members together with a void-free bond-line.


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