Pibrac, France

Augustin Coello Vera

This inventor holds 2 USPTO granted patents. Top assignees: Alcatel Espace, Alcatel N.v.. Active years: 1998-1999.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Augustin Coello Vera. Retrieved from https://idiyas.com/inventor/augustin-coello-vera

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 66(Granted Patents)


Company Filing History:


Years Active: 1998-1999

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2 patents (USPTO):Explore Patents

Title: Augustin Coello Vera: Innovator in Microwave Technology

Introduction

Augustin Coello Vera is a notable inventor based in Pibrac, France. He has made significant contributions to the field of microwave technology, holding a total of 2 patents. His work focuses on the development of compact and reliable integrated circuit assemblies.

Latest Patents

One of his latest patents is the "Compact Microwave Module." This invention provides a microwave module that includes a plurality of stacked elementary structures forming a unit. Each elementary structure comprises a bottom dielectric layer on which an integrated circuit is disposed, and a top dielectric layer covering the circuit. The module is characterized by a connection line between two respective circuits belonging to first and second elementary structures. This connection line consists of an input coplanar line disposed on the top surface of the bottom dielectric layer of the first structure, an output coplanar line on the second structure, and a link coplanar line connecting the two.

Another significant patent is the "High-Density, Highly Reliable Integrated Circuit Assembly." This invention concerns a high-density assembly of integrated circuits that boasts high reliability due to its design and implementation methods. The assembly features one or more interconnection substrates in addition to at least one substrate carrying a plurality of unencapsulated electronic chips. These chips are connected to the interconnection substrate(s) using conventional microwiring techniques. The assembly is designed to be encapsulated in a hermetically sealed case, making it suitable for applications in space, military, and high-performance electronics.

Career Highlights

Augustin Coello Vera has worked with prominent companies such as Alcatel N.V. and Alcatel Espace. His experience in these organizations has contributed to his expertise in microwave technology and integrated circuit design.

Collaborations

He has collaborated with notable professionals in the field, including Christian Tronche and Eric Muller. Their joint efforts have further advanced the innovations in microwave technology.

Conclusion

Augustin Coello Vera is a distinguished inventor whose work in microwave technology has led to significant advancements in integrated circuit assemblies. His patents reflect a commitment to innovation and reliability in electronic design.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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