Company Filing History:
Years Active: 2013
Title: August Spannagel: Innovating Connectivity Solutions in Photonic Integrated Circuits
Introduction
August Spannagel, an inventor based in San Francisco, CA, has made significant contributions to the field of electrical connectivity with his innovative designs. With a focus on enhancing the functionality of photonic integrated circuits (PICs), his patent showcases a remarkable blend of engineering and creativity.
Latest Patents
August Spannagel holds a patent for a dual-level package that serves as an advanced solution for connecting a PIC. The design features a carrier with first and second substrates, facilitating two levels of electrical connectivity. Conductive traces are arranged on both substrates, allowing for an increased number of connections within a compact design. Not only does this innovation optimize space, but it also simplifies testing and access to the upper and lower traces by placing them in the same plane.
Career Highlights
Currently, August Spannagel is associated with Infinera Corporation, where he leverages his expertise in developing cutting-edge technologies for telecommunications. His work at Infinera underlines his commitment to improving connectivity solutions for complex electronic devices.
Collaborations
Spannagel has collaborated with notable colleagues, including Donald J. Pavinski and Charles H. Joyner, who share a vision of advancing technology through innovative inventions. Together, they strive to push the boundaries of what is possible in the realm of photonics and connectivity.
Conclusion
August Spannagel's work exemplifies the spirit of innovation in the field of electrical engineering. His patent for a dual-level package not only enhances the capabilities of photonic integrated circuits, but it also illustrates his dedication to improving connectivity solutions in modern technology. As the industry continues to evolve, inventors like Spannagel play a crucial role in shaping its future.