The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2013
Filed:
Jul. 07, 2009
Donald J. Pavinski, Jr., West Pittston, PA (US);
August Spannagel, San Francisco, CA (US);
Charles H. Joyner, Sunnyvale, CA (US);
Peter W. Evans, Mountain House, CA (US);
Matthew Fisher, Mountain View, CA (US);
Mark J. Missey, San Jose, CA (US);
Donald J. Pavinski, Jr., West Pittston, PA (US);
August Spannagel, San Francisco, CA (US);
Charles H. Joyner, Sunnyvale, CA (US);
Peter W. Evans, Mountain House, CA (US);
Matthew Fisher, Mountain View, CA (US);
Mark J. Missey, San Jose, CA (US);
Infinera Corporation, Sunnyvale, CA (US);
Abstract
Consistent with an aspect of the present disclosure, a package is provided that has a carrier and first and second substrates provided on the carrier. Conductive traces are provided on the first substrate (upper traces) and below it (lower traces) to provide two levels of electrical connectivity to a photonic integrated circuit (PIC) provided on the second substrate. As a result, an increased number of connections can be made to the PIC in a relatively small package, while maintaining adequate spacing and line widths for each trace. In addition, the lower traces are connected to bonding pads on the surface of the first substrate and are thus provided in the same plane as the upper traces. Testing of and access to both upper and lower traces is thus simplified.