Atsushi Okuno

Title: Atsushi Okuno: Innovator in Semiconductor Technology

Introduction

Atsushi Okuno is a prominent inventor based in Osaka-fu, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His innovative approaches have led to advancements in the production and fabrication of electronic components.

Latest Patents

One of Okuno's latest patents is a method for the production of semiconductor packages. This invention outlines a process that includes forming electronic circuits on a wafer, encapsulating the circuits with a sealant using screen printing, and grinding the surface to expose the bumps for solder ball placement. This method notably reduces equipment costs compared to traditional molding techniques. Another significant patent is a fabrication method for electronic components, which aims to reduce the size of components by making the semiconductor substrate thinner while ensuring durability for mobile phone applications. This process involves multiple steps, including applying encapsulating resin and grinding the substrate's back surface.

Career Highlights

Throughout his career, Atsushi Okuno has worked with notable companies such as Sanyu Rec Co., Ltd. and Japan Rec Co., Ltd. His experience in these organizations has contributed to his expertise in semiconductor technology and electronic component fabrication.

Collaborations

Okuno has collaborated with talented individuals in his field, including Noriko Fujita and Yuki Ishikawa. Their teamwork has fostered innovation and development in semiconductor technologies.

Conclusion

Atsushi Okuno's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the future of electronic components and their applications.