The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2003
Filed:
May. 17, 2000
Atsushi Okuno, Osaka, JP;
Noriko Fujita, Osaka, JP;
Yuki Ishikawa, Kyoto, JP;
Noritaka Oyama, Osaka, JP;
Sanyu Rec Co., Ltd., Osaka, JP;
Abstract
An object of the present invention is to present a fabrication method for electronic components that allows further reduction in the size of electronic components by making the semiconductor substrate thinner, and at the same time allows operation as an electronic circuit with no problems, and further, has a durability sufficient to endure even use in a mobile telephone. In order to attain this object, the present invention has a first application process (process S ) in which encapsulating resin is applied to the surface of the substrate on which the posts are formed, a back surface grinding process (process S ) in which the back surface of said substrate is ground, a second application process (process S ) in which an encapsulating resin is applied to the back surface of said substrate after being ground, and a separation process (process S ) in which said substrate is cut along with said encapsulating resin and at the same time individual electronic components are separated.