Higashiomi, Japan

Atsurou Yoneda



Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2012

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1 patent (USPTO):Explore Patents

Title: Atsurou Yoneda: Innovator in Electronic Component Packaging

Introduction

Atsurou Yoneda is a notable inventor based in Higashiomi, Japan, recognized for his contributions to the field of electronic components. With a focus on enhancing the functionality and durability of electronic devices, he has secured a patent that revolutionizes the way heat is managed in electronic component storing packages.

Latest Patents

Atsurou Yoneda holds a patent for an "Electronic Component Storing Package and Electronic Apparatus." This innovative design addresses the challenge of heat generation during the operation of electronic components. His patent includes a heat dissipating member comprising at least five layers, featuring first metal layers with excellent thermal conductivity, alternating with second metal layers that possess a smaller coefficient of thermal expansion. This layered approach ensures that heat generated from the electronic components can be effectively dissipated, thereby enhancing the reliability and performance of electronic devices.

Career Highlights

Throughout his career, Atsurou Yoneda has made significant strides in the field of electronics and materials science. He has worked with prestigious companies such as Kyocera Corporation and Fj Composite Materials Co., Ltd., leveraging his expertise to drive innovation and improve product designs. His professional journey reflects a deep commitment to advancing technology and creating more efficient electronic products.

Collaborations

Atsurou has collaborated with talented individuals in the industry, including Tetsurou Abumita and Yoshiaki Ueda. These partnerships have enriched his work and contributed to the success of his projects, fostering an environment of shared ideas and innovative thinking.

Conclusion

Atsurou Yoneda's contributions to the field of electronic components exemplify the spirit of innovation. His patent not only addresses critical issues of heat management but also sets a standard for future developments in electronics packaging. As technology continues to evolve, Yoneda's work will undoubtedly play a significant role in shaping the future of electronic devices.

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