The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2012
Filed:
Jul. 27, 2007
Atsurou Yoneda, Higashiomi, JP;
Tetsurou Abumita, Higashiomi, JP;
Yoshiaki Ueda, Higashiomi, JP;
Eiki Tsushima, Fuji, JP;
Atsurou Yoneda, Higashiomi, JP;
Tetsurou Abumita, Higashiomi, JP;
Yoshiaki Ueda, Higashiomi, JP;
Eiki Tsushima, Fuji, JP;
Kyocera Corporation, Kyoto, JP;
FJ Composite Materials Co., Ltd., Shizuoka, JP;
Abstract
An electronic component storing package which generates a large quantity of heat during operation and an electronic apparatus storing such an electronic component are provided. In the electronic component storing package and the electronic apparatus, a heat dissipating member () is used which comprising at least five layers including first metal layers () having good thermal conductivity and second metal layers () having a smaller coefficient of thermal expansion and less thickness compared with the first metal layers (), the first metal layers () and second metal layers () being alternately stacked, the first metal layers uppermost and lowermost layers of the layers, a thickness of at least one internally-arranged first metal layer () being thicker than that of the lowermost and uppermost layers. Accordingly, heat generated from the electronic component () can be dissipated well to the outside, and a coefficient of thermal expansion of a mounting portion () can be brought close to that of the electronic component () or the like.