Company Filing History:
Years Active: 1989
Title: Atsuomi Hirata: Innovator in Chip Carrier Technology
Introduction
Atsuomi Hirata is a notable inventor based in Nara, Japan. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative designs for chip carrier packages. With a total of 2 patents, Hirata's work has advanced the efficiency and functionality of integrated circuit technology.
Latest Patents
Hirata's latest patents include a novel plastic molded chip carrier package and a method of fabricating the same. This innovative package features a carrier member molded from plastic material, which integrates a plurality of I/O pins and a conductor member. This design allows for a unitary construction achieved through a single molding process. The package is designed with integral positioning studs that facilitate mounting on printed circuit boards, ensuring a reliable connection. Additionally, he has developed a plastic molded pin grid chip carrier package that arranges I/O pins in a staggered pin grid array. This arrangement simplifies electrical interconnections, making it particularly effective for accommodating a higher number of I/O pins within a limited area.
Career Highlights
Atsuomi Hirata is associated with Matsushita Electric Works, Ltd., where he has contributed to various projects focused on semiconductor technology. His work has been instrumental in enhancing the design and manufacturing processes of chip carrier packages.
Collaborations
Hirata has collaborated with notable colleagues, including Hirokuni Mamiya and Yoshihiko Nakamura. Their combined expertise has fostered innovation in the field of semiconductor packaging.
Conclusion
Atsuomi Hirata's contributions to chip carrier technology exemplify the importance of innovation in the semiconductor industry. His patents reflect a commitment to improving the efficiency and effectiveness of integrated circuit packaging.