The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 1989
Filed:
Nov. 13, 1987
Applicant:
Inventors:
Assignee:
Matsushita Electric Works, Ltd., Osaka, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 72 ; 357 74 ;
Abstract
An improved plastic molded chip carrier package for a semiconductor chip has a plurality of I/O pins arranged on a pin grid array. The pin grid array comprises at least two rows of the I/O pins disposed along the sides of the chip in such a manner that the I/O pins are staggered with respect to those in the other row. The staggered arrangement of the I/O pins makes it easy to provide electrical interconnection between the I/O ports on the chip and the corresponding I/O pins without requiring an elaborate or crowded wiring or connection lines. This is particularly effective when an increased number of the I/O pins are required to be included in the limited area of the chip carrier.