Tokyo, Japan

Athushi Wada

This inventor holds 2 USPTO granted patents. Top assignee: Tokyo Electron Sagami Limited. Active years: 1994-1995.


% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 2

Forward Citations = 32(Granted Patents)


Company Filing History:


Years Active: 1994-1995

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2 patents (USPTO):Explore Patents

Title: Innovations by Athushi Wada

Introduction

Athushi Wada is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of wafer transfer technology. With a total of 2 patents to his name, Wada's work is recognized for its innovative approach to improving wafer handling processes.

Latest Patents

One of Wada's latest patents is a wafer transfer device designed to facilitate the transfer of wafers between a wafer boat and a cassette. This device features a plurality of wafer support plates that are vertically arranged at regular intervals. Each support plate is ring-shaped with a central opening, creating a passage that extends vertically within the boat. The device allows for horizontal transfer of wafers using a fork that can move in both vertical and horizontal directions, as well as swing. Additionally, a wafer push-up disk is incorporated, which is movable through the passage in the boat. This disk has three projections that contact the underside of the wafer without interfering with the fork, ensuring efficient transfer. The fork and push-up disk are controlled in unison to optimize the wafer transfer process.

Career Highlights

Athushi Wada is currently employed at Tokyo Electron Sagami Limited, where he continues to innovate in the field of semiconductor manufacturing. His work has contributed to advancements in wafer processing technology, enhancing efficiency and reliability in the industry.

Conclusion

Athushi Wada's contributions to wafer transfer technology exemplify the spirit of innovation in the semiconductor field. His patents reflect a commitment to improving processes that are vital to modern electronics manufacturing.

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