Company Filing History:
Years Active: 2016
Title: Asuka Il: Innovator in Wiring Board Technology
Introduction
Asuka Il is a notable inventor based in Ogaki, Japan. She has made significant contributions to the field of wiring board technology, holding 2 patents that showcase her innovative approach to semiconductor mounting solutions.
Latest Patents
One of her latest patents is focused on a wiring board and method for manufacturing the same. This invention includes a first insulation layer with first conductive patterns that feature first mounting pads designed to mount a semiconductor element. The wiring structure is positioned within the first insulation layer and includes a second insulation layer, along with second conductive patterns and second mounting pads connected to these patterns. Additionally, third mounting pads are formed on the first insulation layer above the second mounting pads, ensuring that they are positioned to mount the semiconductor element while maintaining a greater distance between adjacent first and third mounting pads compared to the distance between adjacent first mounting pads.
Career Highlights
Asuka Il is currently employed at Ibiden Company Limited, where she continues to develop innovative technologies in the electronics sector. Her work has been instrumental in advancing the efficiency and effectiveness of wiring boards used in various applications.
Collaborations
Throughout her career, Asuka has collaborated with esteemed colleagues, including Masatoshi Kunieda and Makoto Terui. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
Asuka Il's contributions to wiring board technology exemplify her dedication to innovation and excellence in her field. Her patents reflect a commitment to enhancing semiconductor mounting solutions, making her a valuable asset to the industry.