Arvind Hanumantharayappa

Title: Arvind Hanumantharayappa: Innovator in Ball Grid Array Technology

Introduction

Arvind Hanumantharayappa is a notable inventor based in Cupertino, CA. He has made significant contributions to the field of electronics, particularly in the design of ball grid array (BGA) packages. With a total of 3 patents to his name, his work has had a considerable impact on the industry.

Latest Patents

One of Arvind's latest patents is focused on a multi-pitch ball grid array. This invention describes a mixed pitch method of placing pads in a BGA package that includes a BGA substrate and a variety of connectors arranged in an array. The selected pairs of pads are strategically placed on the BGA substrate at a distance defined by a first pitch P1. Additionally, ground pads are positioned at a distance defined by a second pitch P2, where P2 is a multiple of P1, and M is greater than one. This innovative approach allows for improved efficiency in the arrangement of pads on the BGA substrate.

Career Highlights

Arvind is currently employed at Juniper Networks, Inc., where he continues to develop cutting-edge technologies. His expertise in BGA design has positioned him as a valuable asset to his team and the company as a whole.

Collaborations

Throughout his career, Arvind has collaborated with talented individuals such as Granthana Kattehalli Rangaswamy and Srinivas Venkataraman. These collaborations have fostered a creative environment that encourages innovation and the development of new ideas.

Conclusion

Arvind Hanumantharayappa is a distinguished inventor whose work in ball grid array technology has made a significant impact in the electronics industry. His innovative patents and collaborations highlight his commitment to advancing technology and improving electronic design.