Juniper Networks, Inc.

Arvind Hanumantharayappa

Srinivas Venkataraman

Granthana Kattehalli Rangaswamy

A mixed pitch method of placing pads in a ball grid array (BGA) package having a BGA substrate and a plurality of connectors arranged in an array and connected via the pads to the BGA substrate. Selected pairs of the pads are placed on the BGA substrate at a distance defined by a first pitch P1. Ground pads are placed on the BGA substrate at a distance from the selected pairs of pads defined by a second pitch P2, wherein P2=M*P1 and M is greater than one. The selected pairs of the pads on the BGA substrate are also placed at a distance from other selected pairs of the pads defined by the second pitch P2.

Multi-pitch ball grid array

A mixed pitch method of placing pads in a ball grid array (BGA) package having a BGA substrate and a plurality of connectors arranged in an array and connected via the pads to the BGA substrate. Selected pairs of the pads are placed on the BGA substrate at a distance defined by a first pitch PGround pads are placed on the BGA substrate at a distance from the selected pairs of pads defined by a second pitch Pwherein PM*Pand M is greater than one. The selected pairs of the pads on the BGA substrate are also placed at a distance from other selected pairs of the pads defined by the second pitch P

A mixed pitch method of placing pads in a ball grid array (BGA) package having a. BGA substrate and a plurality of connectors arranged in an array and connected via the pads to the BGA substrate. Selected pairs of the pads are placed on the BGA substrate at a distance defined by a first pitch PT. Ground pads are placed on the BGA substrate at a distance from the selected pairs of pads defined by a second pitch Pwherein P=M*Pand M is greater than one. The selected pairs of the pads on the BGA substrate are also placed at a distance from other selected pairs of the pads defined by the second pitch P

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Cupertino, CA, United States of America

Arvind Hanumantharayappa