Hsinchu, Taiwan

Arunima Banerjee

USPTO Granted Patents = 2 

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2020-2022

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2 patents (USPTO):Explore Patents

Title: Arunima Banerjee: Innovator in Semiconductor Packaging

Introduction

Arunima Banerjee is a notable inventor based in Hsinchu, Taiwan. She has made significant contributions to the field of semiconductor packaging, holding two patents that showcase her innovative approach to technology.

Latest Patents

Her latest patents include a method of fabricating a package structure. This package structure consists of a semiconductor die, a redistribution layer, and a plurality of conductive elements. At least one joint in the redistribution layer or on the semiconductor die is connected with the conductive element, facilitating electrical connections among the redistribution layer, the semiconductor die, and the conductive elements. Another patent focuses on the package structure and the method of fabricating the same, emphasizing the same components and connections.

Career Highlights

Arunima Banerjee works at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. Her work has been instrumental in advancing packaging technologies that are crucial for modern electronic devices.

Collaborations

She collaborates with talented coworkers, including Chia-Hsiang Lin and Feng-Cheng Hsu, who contribute to her innovative projects and research.

Conclusion

Arunima Banerjee's work in semiconductor packaging exemplifies her commitment to innovation and technology advancement. Her patents reflect her expertise and the impact she has made in her field.

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