Taiwan Semiconductor Manufacturing Comp. Ltd.

Arunima Banerjee

Shin-Puu Jeng

Shuo-Mao Chen

Feng-Cheng Hsu

Chia-Hsiang Lin

A package structure including a semiconductor die, a redistribution layer and a plurality of conductive elements is provided. At least one joint of the joints in the redistribution layer or on the semiconductor die is connected with the conductive element for electrically connecting the redistribution layer, the semiconductor die and the conductive elements. The fabrication methods for forming a package structure are provided.

Method of fabricating package structure

A package structure including a semiconductor die, a redistribution layer and a plurality of conductive elements is provided. At least one joint of the joints in the redistribution layer or on the semiconductor die is connected with the conductive element for electrically connecting the redistribution layer, the semiconductor die and the conductive elements.

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Hsinchu, Taiwan

Arunima Banerjee