Company Filing History:
Years Active: 2018-2024
Title: Aruna Manoharan: Innovator in Microelectronic Packaging
Introduction
Aruna Manoharan is a prominent inventor based in Chandler, AZ (US). She has made significant contributions to the field of microelectronics, particularly in the development of innovative packaging solutions. With a total of 3 patents to her name, her work has garnered attention for its practical applications and advancements in technology.
Latest Patents
One of Aruna's latest patents is focused on overmolded microelectronic packages containing knurled flanges. This invention provides methods for producing overmolded microelectronic packages that include a molded package body and at least one microelectronic device. The base flange of the package is designed with a knurled surface region, which features a series of trenches arranged in a geometric pattern. This design enhances the bond between the molded package body and the base flange, reducing the likelihood of delamination.
Career Highlights
Aruna Manoharan is currently employed at NXP USA, Inc., where she continues to innovate in the field of microelectronics. Her work has not only advanced the technology but has also contributed to the efficiency and reliability of microelectronic devices.
Collaborations
Throughout her career, Aruna has collaborated with talented individuals such as Audel Sanchez and Jerry Lynn White. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.
Conclusion
Aruna Manoharan's contributions to microelectronic packaging exemplify her dedication to innovation and excellence in her field. Her patents reflect a commitment to improving technology and enhancing the performance of microelectronic devices.