Nxp Usa, Inc.

Aruna Manoharan

Audel Sanchez

David James Dougherty

Jerry Lynn White

Frank Danaher

Hamdan Ismail

Jinbang Tang

Norman Lee Owens

Gary Carl Johnson

Overmolded microelectronic packages containing knurled base flanges are provided, as are methods for producing the same. In various embodiments, the overmolded microelectronic package includes a molded package body, at least one microelectronic device contained in the molded package body, and a base flange to which the molded package body is bonded. The base flange includes, in turn, a flange frontside contacted by the molded package body, a device attachment region located on the flange frontside and to which the at least one microelectronic is mounted, and a knurled surface region. The knurled surface region includes a first plurality of trenches formed in the base flange and arranged in a first repeating geometric pattern. The molded package body extends or projects into the first plurality of trenches to decrease the likelihood of delamination of the molded package body from the base flange.

Overmolded microelectronic packages containing knurled flanges and methods for the production thereof

A semiconductor device includes a lead frame site including a die attach region and corrugated metal leads around the die attach region. Each of the corrugated metal leads includes two or more corrugations. Each of the two or more corrugations includes a first flat horizontal portion, a first vertical portion with a first end directly adjacent and connected to a first end of the first flat horizontal portion, a second flat horizontal portion with a first end directly adjacent and connected to a second end of the first vertical portion, and a second vertical portion with a first end directly adjacent and connected to a second end of the second flat horizontal portion. The first flat horizontal portion is in a different plane than the second flat horizontal portion.

Semiconductor device having corrugated leads and method for forming

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Chandler, AZ, United States of America

Aruna Manoharan