Vancouver, Canada

Aron Tremble

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Wiivv Wearables Inc.. Active years: 2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Aron Tremble. Retrieved from https://idiyas.com/inventor/aron-tremble

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 9.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: Aron Tremble: Innovator in 3D Printing Technology

Introduction

Aron Tremble is a notable inventor based in Vancouver, Canada. He has made significant contributions to the field of 3D printing, particularly with his innovative approach to optimizing print volume efficiency.

Latest Patents

Aron Tremble holds a patent for a technique titled "Bin packing in 3D printers." This patent discloses a method to efficiently pack a print volume of 3D printers that handle print jobs with a large number of objects. The technique focuses on positioning unique objects that share a similar structural pattern more closely together when the degree of variation between the objects is minimal. This innovative approach allows for greater efficiency in the print area of 3D printers.

Career Highlights

Aron Tremble is currently employed at Wiivv Wearables Inc., where he continues to develop and refine his ideas in the realm of 3D printing technology. His work has garnered attention for its potential to enhance the efficiency of 3D printing processes.

Collaborations

Some of his coworkers include Colin Michael Lawson and Michael Charles Salmon. Their collaboration contributes to a dynamic work environment that fosters innovation and creativity.

Conclusion

Aron Tremble's contributions to 3D printing technology exemplify the spirit of innovation in the field. His patent on bin packing techniques showcases his commitment to improving efficiency in manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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