The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10552095 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 04, 2020

Filed:

Nov. 15, 2018
Applicant:

Wiivv Wearables Company, San Diego, CA (US);

Inventors:

Colin M. Lawson, Vancouver, CA;

Michael C. Salmon, West Vancouver, CA;

Carly M Fennell, Vancouver, CA;

Christopher W. Bellamy, Vancouver, CA;

Amy J. Vanden Eynde, Vancouver, CA;

Christopher M. Owen, San Diego, CA (US);

Shamil N. Hargovan, San Jose, CA (US);

Hsiao Ting Lin, Coquitlam, CA;

Aron Tremble, North Vancouver, CA;

Assignee:

Wiivv Wearables Inc., Vancouver, CA;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G05B 19/402 (2006.01); G06F 3/12 (2006.01); B33Y 50/02 (2015.01); B33Y 10/00 (2015.01); G05B 19/4155 (2006.01); G05B 19/4099 (2006.01); G06F 17/50 (2006.01); G06F 16/51 (2019.01); G05B 15/02 (2006.01);
U.S. Cl.
CPC ...
G06F 3/1204 (2013.01); B33Y 10/00 (2014.12); B33Y 50/02 (2014.12); G06F 3/126 (2013.01); G05B 15/02 (2013.01); G05B 19/4099 (2013.01); G05B 19/4155 (2013.01); G05B 2219/49023 (2013.01); G06F 16/51 (2019.01); G06F 17/5009 (2013.01);
Abstract

Disclosed herein is a technique to efficiently pack a print volume of 3D printers having print jobs with a large number of objects. The technique positions unique objects that adhere to a similar structural pattern more closely when the degree of variation between the objects is small. Thus, while each object is unique, a greater extent of similarity between the objects causes a given group of objects to be positioned more closely to one another in the print area of the 3D printer.


Find Patent Forward Citations

Lawson, Colin. (2020). Bin packing in 3d printers (U.S. Patent No. 10552095). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10552095

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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