Location History:
- Nijmegen, NL (2014)
- Beuningen, NL (2012 - 2020)
Company Filing History:
4 out of 734 
3 out of 4,888 
2 out of 5,139 
Years Active: 2012-2020
Title: Innovations by Arnoldus Den Dekker - A Pioneer in Microelectronics Packaging
Introduction
Arnoldus Den Dekker, an accomplished inventor based in Beuningen, Netherlands, has made significant contributions to the field of microelectronics packaging. With a total of six patents to his name, his work primarily focuses on innovative methods and structures that enhance the durability and functionality of microelectronic devices.
Latest Patents
Den Dekker's latest patents include advancements in packaging structures designed to improve hermeticity through the introduction of diffusion barrier layers. One notable patent describes a packaging structure that features hermetically sealed cavities housing microelectronic devices. The cavity is formed between a substrate and a cap layer, which incorporates numerous release holes. Each release hole is securely sealed by individual hermetical plugs made of metallic material, while a non-metallic diffusion barrier layer protects against external atmospheric influences.
Another of his recent innovations outlines a method for managing the atmosphere within these hermetically sealed cavities. This method involves creating a cavity between a support and the cap layer, positioning a sacrificial material alongside the microelectronic device, and ultimately removing the sacrificial material through designated release holes. After the removal process, these holes are hermetically sealed, allowing for precise control of the cavity environment through specially formed dedicated holes.
Career Highlights
Throughout his career, Arnoldus Den Dekker has notably collaborated with prestigious companies such as EPCOS AG and Commissariat à l'Énergie Atomique et aux Énergies Alternatives. His expertise in microelectronics and packaging technology has positioned him as a key player in the industry.
Collaborations
Den Dekker has worked alongside talented professionals in the field, including Damien Saint-Patrice and Marcel Giesen. These collaborations have enabled the exchange of ideas and knowledge, further advancing the innovations in microelectronic packaging technologies.
Conclusion
Arnoldus Den Dekker's work exemplifies the spirit of innovation in the realm of microelectronics. With his focus on enhancing packaging structures and methods, he continues to push the boundaries of what is possible in this critical field, solidifying his legacy as a prominent inventor in the industry. His patents not only showcase his inventive capabilities but also contribute significantly to the future of microelectronic applications.