The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2018
Filed:
Dec. 06, 2013
Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;
Epcos Ag, Munich, DE;
Damien Saint-Patrice, Chabeuil, FR;
Arnoldus Den Dekker, Beuningen, NL;
Marcel Giesen, Munich, DE;
Florent Greco, Seyssins, FR;
Gudrun Henn, Ebenhausen, DE;
Jean-Louis Pornin, Crolles, FR;
Bruno Reig, Moirans, FR;
Commissariat à l'énergie atomique et aux énergies alternatives, Paris, FR;
EPCOS AG, Munich, DE;
Abstract
A method for packaging a microelectronic device in an hermetically sealed cavity and managing an atmosphere of the cavity with a dedicated hole, including making said cavity between a support and a cap layer such that a sacrificial material and the device are arranged in the cavity; removing the sacrificial material through at least one release hole, and hermetically sealing the release hole; making a portion of wettable material on the cap layer, around a blind hole or a part of said outside surface corresponding to a location of said dedicated hole; making a portion of fuse material on the portion of wettable material; making the dedicated hole by etching the cap layer; and reflowing the portion of fuse material with a controlled atmosphere, forming a bump of fuse material which hermetically plugs said dedicated hole.