This inventor holds 1 USPTO granted patent, plus 1 CIPO patent and 2 EPO patents. Top assignee: Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.v.. Active years: 2019.
Company Filing History:
Years Active: 2019
Title: Arne Schirp: Innovator in Multi-Layered Board Production
Introduction
Arne Schirp is a notable inventor based in Braunschweig, Germany. He has made significant contributions to the field of material science, particularly in the production of multi-layered boards. His innovative approach combines traditional materials with modern techniques to create efficient and sustainable products.
Latest Patents
Arne Schirp holds a patent for a "Method for producing an at least two-layered board, and an at least two-layered board." This invention outlines a method that involves creating a carrier layer made from wood or lignocellulose-containing particles or fibers. The board is then coated with a WPC (Wood Plastic Composite) material, which is applied to at least one face of the carrier layer. The process includes providing a finished carrier board, applying the WPC coating material, and pressing the two components together under heat and pressure.
Career Highlights
Arne Schirp is associated with the Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., a leading research organization in Germany. His work focuses on advancing technologies that enhance the production and functionality of composite materials. His innovative methods have the potential to revolutionize the manufacturing processes in various industries.
Collaborations
Arne collaborates with esteemed colleagues such as Volker Thole and Rainer Henniger. Together, they contribute to research and development projects that aim to push the boundaries of material science and engineering.
Conclusion
Arne Schirp's contributions to the field of multi-layered board production exemplify the importance of innovation in material science. His patented methods and collaborative efforts continue to influence the industry positively.
