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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10179345 B1

PDFFull Text
Date of Patent:
Jan. 15, 2019

Filed:

Mar. 03, 2014

Method for producing an at least two-layered board, and an at least two-layered board

Applicant:

Fraunhofer-gesellschaft Zur Förderung Der Angewandten Forschung E.v., München, DE;

Inventors:

Volker Thole, Braunschweig, DE;

Arne Schirp, Braunschweig, DE;

Rainer Henniger, Schelkligen, DE;

Assignee:

FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V., München, DE;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Shamin Ahmed

Assistant Examiner:

Bradford M Gates

Int. Cl.
CPC ...
B05D 7/00 (2006.01); B32B 5/16 (2006.01); B32B 5/22 (2006.01); B32B 5/26 (2006.01); B32B 5/28 (2006.01); B32B 7/12 (2006.01); B32B 21/02 (2006.01); B32B 21/04 (2006.01); B32B 21/08 (2006.01); B32B 21/10 (2006.01); B32B 27/04 (2006.01); B32B 27/12 (2006.01); B32B 27/28 (2006.01); B32B 27/42 (2006.01); E04C 2/24 (2006.01); B05D 3/00 (2006.01); E04F 13/16 (2006.01); E04F 15/10 (2006.01);
U.S. Cl.
CPC ...
B05D 7/52 (2013.01); B05D 3/007 (2013.01); B32B 5/16 (2013.01); B32B 5/22 (2013.01); B32B 5/26 (2013.01); B32B 5/28 (2013.01); B32B 7/12 (2013.01); B32B 21/02 (2013.01); B32B 21/042 (2013.01); B32B 21/08 (2013.01); B32B 21/10 (2013.01); B32B 27/04 (2013.01); B32B 27/12 (2013.01); B32B 27/28 (2013.01); B32B 27/42 (2013.01); E04C 2/246 (2013.01); E04F 13/16 (2013.01); E04F 15/102 (2013.01); E04F 15/107 (2013.01);
Abstract

The invention relates to a method for producing an at least two-layered board. The board has a carrier layer, which consists at least partly of wood or lignocellulose-containing particles or fibers, and at least one coating, which consists of a WPC material and which is arranged on at least one face of the carrier layer. The method has the following steps: providing a finished carrier board () which forms the carrier layer; providing a WPC coating material, for example in the form of a granulate (), on at least one of the two surfaces of the carrier board (); and pressing the WPC coating material and the carrier board () under the influence of heat and pressure.

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