Arnaud Soisson

Title: Arnaud Soisson: Innovator in Electronic Component Encapsulation

Introduction

Arnaud Soisson is a notable inventor based in Neuville Sur Oise, France. He has made significant contributions to the field of electronic components, particularly through his innovative patent. His work focuses on enhancing the encapsulation process of electronic components, which is crucial for their durability and performance.

Latest Patents

Arnaud Soisson holds a patent for a process of encapsulating electronic components. This invention proposes to cover electronic components with a heat-polymerisable material that includes a diimide constituent and a diamine constituent. The diimide constituent is predissolved in the diamine constituent, and the assembly is heated under conditions suitable for curing the material through an addition polymerization reaction. This innovative approach finds applications particularly in the field of electronic power modules, enhancing their reliability and efficiency.

Career Highlights

Arnaud Soisson is currently employed at Valeo Equipements Electriques Moteur, where he continues to develop and refine technologies related to electronic components. His expertise in the encapsulation process has positioned him as a valuable asset in the industry.

Collaborations

Throughout his career, Arnaud has collaborated with talented individuals such as Philippe Banet and Linda Chikh. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Arnaud Soisson's contributions to the encapsulation of electronic components demonstrate his commitment to advancing technology in the electronics field. His innovative patent and collaborative efforts highlight his role as a key inventor in this important area.